Link: https://www.tomshardware.com/pc-components/cpus/amd-had-to-re-engineer-the-ryzen-7-5800x3d-for-a-re-release-10th-anniversary-edition-chip-had-a-whole-body-of-engineering-work-put-into-it

AMD’s David McAfee, VP and general manager of Radeon and Ryzen, says that “a whole body of engineering work” went into the re-release, as the original bonding process TSMC used for the Ryzen 7 5800X3D was no longer available.

[...]

“It completely changed the characteristics of how those two pieces of silicon are bonded together and how they were stacked together, and so when that first-gen facility really kind of went offline, then it meant there was a whole, you know, body of engineering work that had to be done to understand if we could even migrate the 5800X3D to the new, second-generation stacking process,” McAfee said.

Well, a facility that can handle that process going offline explains why the processor stopped being produced even though it's been in high demand for a while.

Surprised to hear that the TSMC node isn't available at all. One would think if they went with all the trouble of porting their design to a different node, they would add something extra for all those of us who are not moving off AM4 in the next 3+ years.